High Reliability Microprocessors

With over 25 years of experience in the microprocessor market  and in close partnership with Freescale Semiconductor, e2v offers a wide range of high reliability microprocessor products dedicated to serve Hi Rel applications such as avionics, defence, space, industrial and field telecommunications. The Hi Rel microprocessors are based on PowerPC and 68k architecture and are supported by a range of key peripherals in partnership with Tundra Semiconductor.

e2v is committed to guaranteeing long-term availability of these products: Wafer storage and foundry transfer. We also offer assembly and test services.

The Hi-rel microprocessors are based on commercial products selected, qualified, screened and packaged to satisfy the most severe environmental conditions.

• 68K family
• POWERPC family

e2v is supporting the PowerPC microprocessor in extended and military temperature and a range of critical peripherals such as PCI bridge, clock driver, and communication controllers.

Roadmap

Added-value Services and Solutions

• Electrical test and characterization over a wide temperature range
• Package offer and solutions: HiTCE Ceramic, Column Grid Array, Hermetic packages
• Die processing : high and low temperature probe test and screening
• Long term availability through wafer storage and long term order policy

Applications

Defence / Space

• Radar Systems
• Electronic Warfare
• Counter Measures

Avionics

• Flight Computers
• Flight Control Systems
• Voice Data Recorders
• Displays
• Engine Controllers

Telecom & Industrial

• Heavy Industry
• Industrial Computer
• Field Networking System
• Power Plant Control

Product Overview

e2v''s hi-rel microprocessors product line delivers a wide range of extended reliability products and services based on PowerPC and 68K microprocessors for professional electronics markets, specifically:

• Host and integrated processors from a 25 year partnership with Freescale
• System interconnect products in partnership with Tundra, resulting from a formal agreement signed in July 2006

Added-value services and solutions:

• Electrical test and characterization over a wide temperature range
• Enhanced reliability packaging: Hi-TCE ceramic, column-interposer, hermetic packages
• Die Processing : high and low temperature electrical test and screening
• Long term availability : Long life time item selection and die-banking capability
• Companion devices sssembly & test services (FSRAM’s, SDRAM’s, ASIC’s,...)

Product Supply & Licence of Technological Information Agreement :

• Allows e2v to address the extended reliability market with 68K & PowerPC products
• Provides access to PowerPC Intellectual Property:
•        Hardware : Test Load Boards, Burn-in Hardware
•        Software : Original Test Programs
•        IP’s : technology and packaging information,
         advanced product specifications & models

Manufacturing Services Agreement :

• Our industrial facilities have beene certified by Freescale since 1998 for PowerPC Assembly & Test

Customer Focus :

• Strategic meetings for product roadmap discussions and ongoing design strategy
•  Technical meetings for product technology transfer and device characterisation